QFN : Quad Flat No Leads:
These connect IC's to PCB's without through-holes.The figure shows with lead frame and wire bonding. Flat no-lead packages include an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Hand soldering is not possible with this package
QFP: Quad Flat Package
A surface mounted IC, pins extending for all the 4 sides. Socketing such packages is rare and through-hole mounting is not possible.
LQFP: Low Profile Quad Flat Package (1.4mm)
TQFP: Thin Quad Flat Package (1.0 mm)
Has shorter leads than the LQFP. To be used in a space constrained designs.Helps in solving increased board density.
References
https://en.wikipedia.org/wiki/Quad_Flat_No-leads_packagehttps://en.wikipedia.org/wiki/Quad_Flat_Package
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